feat: implement UTDFN-4-EP (1x1mm) footprint - #704
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Add utdfn for the ultra-thin DFN 4-pin 1.0x1.0mm package with exposed pad, used by JLCPCB parts such as FP6182-28X7 and MIC5366-xYMT. Dimensions follow the Diodes X2-DFN1010-4 (Type B) package outline and suggested pad layout (pitch 0.65mm, 0.35x0.35mm pads with the inner corner chamfered for exposed-pad clearance, 0.53x0.53mm center pad), which also matches the Micrel 4-pin 1x1mm Thin MLF (MT) package. - src/fn/utdfn.ts: chamfered polygon signal pads + rect exposed pad, corner silkscreen marks and pin-1 arrow, courtyard - footprinter string support: utdfn_4_ep, utdfn4_ep and hyphenated aliases UTDFN-4-EP(1x1) / UTDFN-4-EP - snapshot and alias tests, plus a pad/exposed-pad overlap check
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Closes #183
Summary
Implements
utdfnfor the UTDFN-4-EP (1x1mm) package — 4 signal pads on the top/bottom rows plus a centered exposed pad on a 1.0 x 1.0mm body. This is the package used by the JLCPCB parts linked in the issue (FP6182-28X7, MIC5366-xYMT).Dimensions follow two independent manufacturer references for this package class:
e = 0.65mm, padsX × Y = 0.35 × 0.35mm, outer spansX3 = 1.00mm/Y2 = 1.10mm, center pad0.53 × 0.53mm, pad-to-EP gapX1 = 0.112mm.Because a square 0.53mm exposed pad would overlap plain rectangular pads in this tiny package, each signal pad reproduces the manufacturer's suggested layout as a polygon with the inner corner chamfered at 45° (0.24mm legs, measured from the Diodes drawing). This keeps ≥0.11mm pad-to-EP clearance (matching
X1 = 0.112mm), and a test asserts the pads never overlap the exposed pad.Supported strings:
utdfn_4_ep,utdfn4_ep,UTDFN-4-EP,UTDFN-4-EP(1x1)(JLCPCB package name).Verification
bun test→ 437 pass / 0 fail (new snapshot + alias + pad-overlap tests intests/utdfn.test.ts)bun run buildsucceedsPackage_DFN_QFN.pretty).Note: this PR was prepared with assistance from an AI coding agent; dimensions were verified against the manufacturer documents linked above.